Samsung Electronics presented 3nm products to US President Joseph Biden in May 2013. By the end of June, they had started mass production and were shipping the chips to one of their Chinese customers. According to Korean media reports, 3nm yields has risen significantly and scrap rates are down accordingly.
The Korea Economic Daily reported this, citing anonymous representatives from Samsung Electronics. The quality of the 3-nm chip production on the Samsung assembly line is now known. “reached perfection”The source says that the company is on the verge of developing the next generation of 3nm technology.
Samsung was the first company to combine the structure and surrounding gate (GAA), and 3-nm-lithography. Competitor TSMC launched 3nm products in the third quarter of last year, but continues to use the more-studied FinFET structure. Apple is expected to become TSMC’s third 3nm customer.
Rumours claim that TSMC has achieved an impressive 85% yield on 3nm products. However, Korean industry sources doubt the validity of such claims. They believe that the actual yield of TSMC products at this point in the 3-nm process technology’s lifecycle is less than half of what it claims to be. Rumours also claimed that Samsung had problems with high levels of defects during the early stages of the 3nm process. It was later reported that only a tenth of manufactured chips are subject to quality control. It is possible to expect much better results.
NVIDIA Technologies, Qualcomm Technologies and Google were among the first to learn that Samsung Electronics would be accepting 3nm product orders from them. As of the end of September last year, Samsung, according to TrendForce, occupied 16.4% of the market for contract chip manufacturing services, while TSMC owned all 53.4% of this market.